Research · Nov 3, 2026
Specialty Chip Foundries Lift 2027 Wafer Prices
UMC and Tower Semiconductor say tight specialty capacity lets them lift 2027 blended wafer prices about 10% and 20%, shifting cost pressure to fabless chipmakers.
Research · Oct 29, 2026
UMC Q3 2026 earnings: flat ASP, 10% blended price rise targeted for 2027
UMC's Q3 2026 utilization rose to 92% and gross margin to 34.0%, but ASP held flat; management now targets a roughly 10% blended ASP increase in 2027.
Research · Oct 27, 2026
AI Chip Packaging Capacity Shifts Outside TSMC
TSMC buys silicon interposers from GlobalFoundries and Amkor has prepayment deals with about 12 customers as AI chip packaging capacity runs short.
Research · Oct 20, 2026
[UMC] UMC: Q3 2026 earnings preview on utilization, pricing and gross margin
UMC's Q2 2026 gross margin rose to 32.5% at 85% utilization and Q3 sales hit NT$74.24 billion; Q3 tests whether 90%+ loading lifts margin past rising depreciation.
Research · Sep 3, 2026
[UMC] United Microelectronics Thesis 2026: Mature Node Specialization and Singapore Expansion Advance
United Microelectronics FY25 revenue NT$237.5B (+2.3%); gross margin 29% (vs 32.6% FY24); op income NT$43.9B; NI NT$41.7B. Q4 utilization 78%; 22/28nm 36% of Q4 revenue (40% Q2). Singapore Fab 12i Phase 3 completed (volume production early 2026). Intel 12nm collaboration: PDK June 2026, tape-out 2027. Polar Semiconductor MoU. 55nm BCD platform ready. FY26 capex USD $1.5B (vs $1.8B FY25); Q1 GM high 20%; mid-70% utilization. Mgmt expects FY26 to be growth year on 22nm tape-out acceleration.
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