Nexchip Semiconductor Corp. (688249.SH) Latest Company News

Sep 11, 2026, 05:42 UTC
Nexchip Semiconductor's registered capital increased from 2.008 billion yuan to 2.235 billion yuan, completing a business registration change.
Source:
- finance.sina.cn
Sep 10, 2026, 15:55 UTC
Multiple Chinese semiconductor manufacturing and equipment companies are accelerating capacity construction and expanding into 2.5D packaging and CPO/NPO directions.
Source:
- wap.eastmoney.com
Sep 10, 2026, 10:53 UTC
Nexchip Semiconductor held its half-year results briefing on September 10, 2026, where chairman Cai Guozhi said the company's capacity utilization remains at a high level and orders are sufficient.
Source:
- finance.sina.cn
Sep 10, 2026, 09:28 UTC
Nexchip Semiconductor stated that its Phase IV project is undergoing cleanroom decoration, with capacity expansion progressing steadily, and that it will purchase equipment according to the expansion plan.
Source:
- finance.sina.cn
Aug 31, 2026, 10:14 UTC
Nexchip Semiconductor and other investors signed a capital increase agreement with Anhui Ruijing Semiconductor on August 31, 2026, with Nexchip contributing its wholly-owned subsidiary Hefei Ruiyu's 100% equity valued at 241 million yuan, resulting in Nexchip directly holding 26.43% of Anhui Ruijing.
Source:
- finance.sina.cn
Jul 17, 2026, 09:23 UTC
CICC increased its stake in Nexchip's H-shares to 22.71%.
Source:
Jun 30, 2026, 03:40 UTC
Nexchip Semiconductor filed for a Hong Kong listing to raise capital for expansion.
Source:
Jun 5, 2026, 07:35 UTC
Nexchip Semiconductor carves out its BGBM business assets and contributes them to Anhui Ruijing Semiconductor, a new power device wafer-processing venture in Wuhu, Anhui Province, to refocus on its 12-inch foundry business.
Source:
- digitimes.com

688249.SH

Nexchip Semiconductor's registered capital increased from 2.008 billion yuan to 2.235 billion yuan, completing a business registration change.

Multiple Chinese semiconductor manufacturing and equipment companies are accelerating capacity construction and expanding into 2.5D packaging and CPO/NPO directions.

Nexchip Semiconductor held its half-year results briefing on September 10, 2026, where chairman Cai Guozhi said the company's capacity utilization remains at a high level and orders are sufficient.

Nexchip Semiconductor stated that its Phase IV project is undergoing cleanroom decoration, with capacity expansion progressing steadily, and that it will purchase equipment according to the expansion plan.

CICC increased its stake in Nexchip's H-shares to 22.71%.

Nexchip Semiconductor filed for a Hong Kong listing to raise capital for expansion.

Nexchip Semiconductor carves out its BGBM business assets and contributes them to Anhui Ruijing Semiconductor, a new power device wafer-processing venture in Wuhu, Anhui Province, to refocus on its 12-inch foundry business.