Nexchip Semiconductor Corp. (688249.SH) Stock Price, Financials & Summary | drillr

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Aug 20Aug 25Aug 28Sep 2Sep 7Sep 10Sep 15Sep 18

Key dataSep 18, 2026

OpenCNY 35.68

From 52W high−41.02%

Volume24.29M

Market capCNY 85.94B

P/E (TTM)122.0x

P/S (TTM)7.3x

Div yield—

Key dataSep 18, 2026

Open

CNY 35.68

From 52W high

−41.02%

Volume

24.29M

Market cap

CNY 85.94B

ValuationView details →

P/E (Fwd)

40.4x

EV/EBITDA

22.8x

P/E (TTM)

122.0x

RSI (14)

47.3

MomentumView details →

1D Return

−1.69%

YTD Return

—

ValuationView details →

P/E (Fwd)

40.4x

P/E (TTM)

122.0x

EV/EBITDA

22.8x

EV/Sales

9.3x

P/S (TTM)

7.3x

P/B (TTM)

3.9x

ProfitabilityView details →

Gross Margin

24.02%

Net Margin

5.52%

EBITDA Margin

40.94%

ROE (TTM)

2.83%

ROA (TTM)

1.13%

Asset Turnover

0.21x

GrowthView details →

Revenue YoY

+17.11%

EPS YoY

+5.94%

FCF YoY

+11.99%

Revenue CAGR 3Y

+2.69%

EPS CAGR 3Y

−43.72%

EBITDA YoY

—

MomentumView details →

1D Return

−1.69%

YTD Return

—

1Y Return

—

RSI (14)

47.3

vs 50D SMA

−8.42%

vs 200D SMA

—

Capital & dividendView details →

Debt/Equity

0.81x

Current Ratio

1.61x

Quick Ratio

1.30x

Div Yield

—

Div Rate

—

Div Growth 1Y

—

EarningsView details →

EPS (Actual)

CNY 0.10

EPS Surprise

−16.67%

Beats (12Q)

0/12

Next Q EPS Est

CNY 0.15

Avg Surprise (4Q)

−16.67%

Rev Surprise

−85.28%

Financials snapshotView financials →

Revenue (TTM)

11.23B

Net Income (TTM)

619.39M

Op. CF (TTM)

4.22B

Next earningsNov 4, 2026 →

Latest newsMore news →

Nexchip Semiconductor's registered capital increased from 2.008 billion yuan to 2.235 billion yuan, completing a business registration change.9d ago

Multiple Chinese semiconductor manufacturing and equipment companies are accelerating capacity construction and expanding into 2.5D packaging and CPO/NPO directions.10d ago

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Latest newsMore news →

Nexchip Semiconductor's registered capital increased from 2.008 billion yuan to 2.235 billion yuan, completing a business registration change.9d ago Multiple Chinese semiconductor manufacturing and equipment companies are accelerating capacity construction and expanding into 2.5D packaging and CPO/NPO directions.10d ago Nexchip Semiconductor stated that its Phase IV project is undergoing cleanroom decoration, with capacity expansion progressing steadily, and that it will purchase equipment according to the expansion plan.10d ago