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INTEL CORP

NASDAQ · Technology · Semiconductors · US

$108.60
−0.18%
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  • Sep 19, 2026, 10:30 UTC

    Intel suspended its bug bounty program that paid up to $100,000 per flaw and launched a new vulnerability disclosure program through Intigriti that offers no rewards.

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  • Sep 18, 2026, 22:00 UTC

    Intel Foundry moved ASML's high numerical aperture (High-NA) EUV lithography into production.

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  • Sep 18, 2026, 13:55 UTC

    Intel and 3D Glass Solutions signed an MOU for a partnership aimed at bringing $3.3 Bn (₹30,550 Cr) in investment and over 1,800 direct jobs to Odisha.

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  • Sep 18, 2026, 09:12 UTC

    India accounts for around 20% of the global chip design and VLSI workforce, with over 85,000 semiconductor skill sets generated in the country in the past four years, according to Intel's senior vice president Iyengar speaking at SEMICON India 2026.

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  • Sep 18, 2026, 06:48 UTC

    TrendForce reports that TSMC's CoWoS-L 2.5D advanced packaging technology is expected to remain the mainstream AI chip packaging solution through 2028 despite competition from Intel's EMIB-T.

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  • Sep 17, 2026, 18:15 UTC

    RayVector Technologies demonstrated its multi-sensor module and wafer-handling technology for AI-based wafer defect detection at SEMICON India 2026 in Dwarka, New Delhi.

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  • Sep 17, 2026, 17:45 UTC

    ASRock has begun shipping six Z990 chipset motherboard models, including Steel Legend, Taichi Creator, Challenger, Taichi White, Challenger WiFi White, and PRO RS WiFi, from Taiwan and Vietnam ahead of the platform's official launch.

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  • Sep 17, 2026, 16:10 UTC

    Intel announced advancements in AI inference with stronger Xeon 6 and Arc Pro B-series GPU results, software gains and a new retrieval-augmented generation benchmark.

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  • Sep 17, 2026, 15:22 UTC

    Chip stocks, including Micron and Intel, rallied on Thursday, continuing their comeback from a sharp selloff earlier in the week.

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  • Sep 17, 2026, 14:09 UTC

    US stock futures rose on September 17, 2026, with Dow futures up 582 points (1.13%), S&P 500 futures up 1.21% and NASDAQ 100 futures up 1.58%, as technology shares gained and oil prices retreated.

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  • Sep 17, 2026, 13:54 UTC

    Intel shares extended gains to 8%.

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  • Sep 17, 2026, 12:34 UTC

    Micron Technology stock rose after Intel CEO Lip-Bu Tan highlighted soaring memory prices.

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  • Sep 17, 2026, 12:01 UTC

    Nota AI launched its integrated NVA solution on Intel Arc Pro B70, expanding customer options for visual AI infrastructure.

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  • Sep 17, 2026, 08:48 UTC

    Advantech partnered with Intel, Qualcomm and AMD to expand its WEDA-driven edge AI ecosystem.

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  • Sep 17, 2026, 06:35 UTC

    Intel CEO Lip-Bu Tan said Intel's 14A process node is ahead of schedule and will begin trial production in the first quarter of 2027.

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  • Sep 17, 2026, 00:00 UTC

    Intel shares rose about 4% and SK hynix shares gained around 3% on Wednesday, September 16, amid reports of their Ohio AI chip partnership talks.

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  • Sep 16, 2026, 19:41 UTC

    Intel CEO warned that memory supply will become a major bottleneck for the semiconductor industry and that CPU supply will tighten, with a memory crunch expected in 2027.

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  • Sep 16, 2026, 16:50 UTC

    Delos Data, a startup founded by Intel veterans, raised $100 million from Matrix, Playground, Socratic Partners and others to develop network chips and software connecting AI chips in data centers.

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  • Sep 16, 2026, 13:00 UTC

    Hang Ten Systems, an AI startup founded by former Infosys CEO Vishal Sikka, raised an additional $53 million in seed funding led by Temasek's early-stage platform Xora, bringing total funding to $85 million.

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  • Sep 16, 2026, 10:06 UTC

    Intel (INTC.O) shares accelerated their pre-market decline, with gains narrowing to 3%.

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  • Sep 16, 2026, 08:24 UTC

    Intel CEO Lip-Bu Tan said Intel is betting its future on a revival of its foundry business while CPU demand surges and supply remains tight.

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  • Sep 16, 2026, 06:51 UTC

    Intel CEO Lip-Bu Tan said at an industry event that Intel will soon announce something in the substrate area, while highlighting power and cooling as semiconductor bottlenecks and the shift toward system-level architecture.

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  • Sep 16, 2026, 05:55 UTC

    SK Hynix is in talks with Intel about a deal that would see SK Hynix manufacture memory chips on U.S. soil, though potential opposition from Seoul could be a major hurdle.

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  • Sep 15, 2026, 23:59 UTC

    One hundred companies, foundations, and states have signed up to contribute to Trump Accounts, a child savings program created by the One Big Beautiful Bill Act, with Goldman Sachs, Morgan Stanley, JPMorgan Chase, Bank of America, Wells Fargo, Nvidia, Intel, IBM, Chipotle, and Uber matching deposits for employees' children.

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  • Sep 15, 2026, 23:30 UTC

    Dell Technologies held its 14th parent-and-child PC assembly class at its Miyazaki Customer Center in Miyazaki, Japan, where seven children assembled 14-inch Dell 14 DC14250 laptops from nine parts and 23 screws and kept the finished units.

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  • Sep 15, 2026, 12:15 UTC

    AI-linked semiconductor stocks fell on Monday, with Nvidia down more than 3% and Intel, AMD, and Marvell dropping 5%-6%, dragging the Philadelphia Semiconductor Index down almost 6%, while Alphabet, Microsoft, and Meta rose.

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  • Sep 12, 2026, 00:03 UTC

    Intel (INTC) shares traded 2.5% higher near $102.84 late Friday, extending a run that carried the chipmaker above $100.

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  • Sep 11, 2026, 07:01 UTC

    Intel Foundry and ASML said high-NA EUV has processed more than 1 million wafers, including select production layers for Panther Lake, with Intel 18A high-NA layers meeting or exceeding comparable patterns made with conventional EUV.

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  • Sep 10, 2026, 15:41 UTC

    ASML expanded its High-NA lithography ties with Samsung and Intel amid building AI demand.

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  • Aug 31, 2026, 08:33 UTC

    Intel unveiled three new chip architectures—Diamond Rapids, Crescent Island GPU, and Wildcat Lake SoC—for agentic AI and enterprise workloads, built on its 18A process and Foveros Direct 3D packaging.

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  • Aug 28, 2026, 10:30 UTC

    Intel's 14A process node defect density is improving faster than expected, with CFO stating performance not seen since 22nm.

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  • Aug 18, 2026, 17:32 UTC

    TSMC's advanced packaging CoWoS capacity is oversubscribed, and some back-end orders are reportedly spilling over to Intel's Malaysia plant, which will use partial capacity to support common major customers, breaking past ecosystem conventions.

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  • Jul 30, 2026, 23:59 UTC

    Taiwan Semiconductor Manufacturing Co. (TSMC) is developing a new advanced chip-packaging technology, internally called 'EMIB-like', in partnership with Kinsus Interconnect Technology Corp.

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