Hangzhou Lion Electronics Co., Ltd. (605358.SH) Latest Company News

Nov 4, 2026, 08:14 UTC
Wang Minwen pledged 25 million shares of Zhejiang Liaoning Microelectronics, representing 24.22% of his holdings and 3.24% of the company’s total shares, to Tibet Trust as collateral for a loan repayment.
Source:
- finance.sina.cn
Nov 3, 2026, 07:46 UTC
Three acting-in-concert shareholders of Zhejiang Liaoning Microelectronics reduced their combined stake by 7.7 million shares, or 1% of the company, lowering the disclosed group’s holding from 22.58% to 21.58%; the previously disclosed plan was completed and control did not change.
Source:
- finance.sina.cn
Oct 23, 2026, 09:08 UTC
Lianovation Microelectronics reported third-quarter 2026 revenue of 1.226 billion yuan, up 25.90% year over year, and net profit of 90.1818 million yuan, up 373.03%; nine-month revenue was 3.32 billion yuan, up 25.79%, and net profit was 174 million yuan, compared with a loss a year earlier.
Source:
- finance.sina.cn
Oct 9, 2026, 08:04 UTC
Leaon Micro-electronics plans to acquire a 3.6221% stake in Jinruihong Microelectronics (Quzhou) from Guotou (Shanghai) Technology Achievement Transformation Venture Capital Fund through a public listing, at a floor price of RMB 269 million; its direct stake would rise from 57.4403% to 61.0624% if completed.
Source:
- finance.sina.cn
Oct 9, 2026, 08:04 UTC
Lyon Microelectronics appointed Zhang Jiuhai as board secretary, replacing Wu Nengyun, whose resignation from the role took effect upon delivery of his resignation report to the board.
Source:
- finance.sina.cn
Sep 21, 2026, 09:56 UTC
Hangzhou Lion Microelectronics shareholders and executives completed a share-reduction plan between June 22 and September 21, 2026, with Shanghai Bijing Investment Consulting selling 69,000 shares and Wu Nengyun selling 167,900 shares, while Xian Chunlei sold none.
Source:
- finance.sina.cn
Aug 31, 2026, 07:40 UTC
Li Ang Wei acquired an additional 11.4705% stake in Zhejiang Jinruihong from Guotou Venture Capital, increasing its total ownership to 100% after completing the first payment of 159 million yuan and the business registration change.
Source:
- finance.sina.cn
Aug 26, 2026, 10:36 UTC
Li Ang Wei signed a framework agreement with Jiaxing Nanhu District government to invest about 3 billion yuan in a semiconductor silicon wafer project with monthly capacity of 200,000 12-inch lightly doped substrates and 120,000 12-inch epitaxial wafers.
Source:
- finance.sina.cn
- wap.eastmoney.com

605358.SH

Wang Minwen pledged 25 million shares of Zhejiang Liaoning Microelectronics, representing 24.22% of his holdings and 3.24% of the company’s total shares, to Tibet Trust as collateral for a loan repayment.

Three acting-in-concert shareholders of Zhejiang Liaoning Microelectronics reduced their combined stake by 7.7 million shares, or 1% of the company, lowering the disclosed group’s holding from 22.58% to 21.58%; the previously disclosed plan was completed and control did not change.

Lianovation Microelectronics reported third-quarter 2026 revenue of 1.226 billion yuan, up 25.90% year over year, and net profit of 90.1818 million yuan, up 373.03%; nine-month revenue was 3.32 billion yuan, up 25.79%, and net profit was 174 million yuan, compared with a loss a year earlier.

Lyon Microelectronics appointed Zhang Jiuhai as board secretary, replacing Wu Nengyun, whose resignation from the role took effect upon delivery of his resignation report to the board.

Hangzhou Lion Microelectronics shareholders and executives completed a share-reduction plan between June 22 and September 21, 2026, with Shanghai Bijing Investment Consulting selling 69,000 shares and Wu Nengyun selling 167,900 shares, while Xian Chunlei sold none.

Li Ang Wei acquired an additional 11.4705% stake in Zhejiang Jinruihong from Guotou Venture Capital, increasing its total ownership to 100% after completing the first payment of 159 million yuan and the business registration change.

Li Ang Wei signed a framework agreement with Jiaxing Nanhu District government to invest about 3 billion yuan in a semiconductor silicon wafer project with monthly capacity of 200,000 12-inch lightly doped substrates and 120,000 12-inch epitaxial wafers.