NORITAKE CO.,LIMITED (5331.T) Stock Price, Financials & Summary | drillr

Skip to content

Sign in Sign up

Price chart

Aug 20Aug 25Aug 28Sep 2Sep 7Sep 10Sep 15Sep 18

Key dataSep 18, 2026

OpenJPY 3,660.00

From 52W high−20.70%

Volume319000.00

Market capJPY 98.99B

P/E (TTM)12.7x

P/S (TTM)0.7x

Div yield4.44%

Key dataSep 18, 2026

Open

JPY 3,660.00

From 52W high

−20.70%

Volume

319000.00

Market cap

JPY 98.99B

ValuationView details →

P/E (Fwd)

8.0x

EV/EBITDA

4.7x

P/E (TTM)

12.7x

RSI (14)

55.5

MomentumView details →

1D Return

+0.28%

YTD Return

+28.37%

ValuationView details →

P/E (Fwd)

8.0x

P/E (TTM)

12.7x

EV/EBITDA

4.7x

EV/Sales

0.8x

P/S (TTM)

0.7x

P/B (TTM)

0.6x

ProfitabilityView details →

Gross Margin

28.67%

Net Margin

9.92%

EBITDA Margin

11.70%

ROE (TTM)

8.45%

ROA (TTM)

6.16%

Asset Turnover

0.63x

GrowthView details →

Revenue YoY

+3.42%

EPS YoY

−9.10%

FCF YoY

—

Revenue CAGR 3Y

+0.81%

EPS CAGR 3Y

−28.43%

EBITDA YoY

—

MomentumView details →

1D Return

+0.28%

YTD Return

+28.37%

1Y Return

+55.30%

RSI (14)

55.5

vs 50D SMA

+3.00%

vs 200D SMA

+7.78%

Capital & dividendView details →

Debt/Equity

0.08x

Current Ratio

2.05x

Quick Ratio

1.81x

Div Yield

4.44%

Div Rate

JPY 180.00

Div Growth 1Y

+33.33%

EarningsView details →

EPS (Actual)

—

EPS Surprise

—

Beats (12Q)

—

Next Q EPS Est

—

Avg Surprise (4Q)

—

Rev Surprise

—

Financials snapshotView financials →

Revenue (TTM)

142.91B

Net Income (TTM)

14.18B

Op. CF (TTM)

—

Next earningsNov 10, 2026 →

Latest newsMore news →

Noritake announced on September 2 that it developed a polishing pad containing diamond abrasive grains for use in manufacturing silicon carbide (SiC) wafers, which can polish the outer periphery of SiC wafers and improve yield, using only water without abrasive.18d ago

Noritake developed a PFAS removal device for semiconductor factories, with sales planned by fiscal year 2026.32d ago

Similar companies

The Kodensha,Co.,Ltd.1948.T G-TEKT CORPORATION5970.T NICHIHA CORPORATION7943.T NORITZ CORPORATION5943.T ASAHI KOGYOSHA CO.,LTD.1975.T PS Construction Co.,Ltd.1871.T Find similar companies →

Latest newsMore news →

Noritake announced on September 2 that it developed a polishing pad containing diamond abrasive grains for use in manufacturing silicon carbide (SiC) wafers, which can polish the outer periphery of SiC wafers and improve yield, using only water without abrasive.18d ago Noritake developed a PFAS removal device for semiconductor factories, with sales planned by fiscal year 2026.32d ago