002156.SZ
TongFu Microelectronics Co., Ltd.
SZSE · Technology · C 制造业 · CN
CNY 61.24
−4.13%Sep 11, 2026, 10:14 UTC
Tongfu Microelectronics completed a private placement of 76.2008 million A-shares, raising its total share capital from 1.518 billion to 1.594 billion shares.
Source:Sep 11, 2026, 10:14 UTC
Nantong Huada Microelectronics Group's stake in Tongfu Microelectronics was passively diluted from 18.80% to 17.90% after the company's share issuance, while its holding of 285.3447 million shares remained unchanged.
Source:Aug 28, 2026, 09:36 UTC
Tongfu Microelectronics released its 2026 semi-annual report, reporting net profit of 1.717 billion yuan, up 316.77% year-on-year.
Aug 24, 2026, 01:03 UTC
Tongfu Microelectronics established a wholly-owned subsidiary, Nantong Tongfu Runtong Microelectronics Co., Ltd., with a registered capital of 500 million yuan, to engage in integrated circuit design, manufacturing, and sales.
Source:Aug 3, 2026, 05:04 UTC
Chinese advanced packaging companies including JCET, Huatian Technology, SDIC, Tongfu Microelectronics, and Shenghe Jingwei are expanding advanced packaging capacity to address global supply shortages.
Source:Jul 3, 2026, 10:44 UTC
China Securities Regulatory Commission approved Tongfu Microelectronics' application to issue shares to specific investors.
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