000021.SZ
Shenzhen Kaifa Technology Co., Ltd.
SZSE · Technology · C 制造业 · CN
CNY 36.79
−2.93%Sep 10, 2026, 22:04 UTC
Shenzhen Kaifa Technology plans to invest CNY1.85 billion (about US$260 million) to expand high-end memory-chip packaging and testing capacity through its wholly owned subsidiary Payton.
Source:Sep 9, 2026, 10:45 UTC
Shenzhen Kaifa Technology's wholly-owned subsidiary Peidun Technology plans to invest 1.85 billion yuan to expand high-end memory chip packaging and testing capacity, including building a new plant and an advanced packaging R&D line, with completion targeted for December 2028.
Sep 9, 2026, 10:44 UTC
Shenzhen Kaifa Technology announced that Han Zongyuan resigned as chairman and director due to retirement, and Zhou Gengshen was elected as the new chairman of the tenth board of directors.
Source:Aug 3, 2026, 05:04 UTC
Chinese advanced packaging companies including JCET, Huatian Technology, SDIC, Tongfu Microelectronics, and Shenghe Jingwei are expanding advanced packaging capacity to address global supply shortages.
Source:Jul 3, 2026, 03:55 UTC
Shenzhen Kaifa Technology (000021.SZ) issued a stock price abnormal fluctuation self-inspection announcement on June 30, 2023, clarifying that its HBM technology is still in the R&D stage and warning of multiple operational risks.
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