盛合晶微半导体有限公司 (688820.SH) Stock Price, Financials & Summary | drillr

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Sep 9Sep 14Sep 17Sep 22Sep 28Oct 8Oct 13Oct 16

Key dataOct 16, 2026

OpenCNY 96.50

From 52W high−46.53%

Volume7.98M

Market capCNY 228.08B

P/E (TTM)247.8x

P/S (TTM)25.8x

Div yield—

Key dataOct 16, 2026

Open

CNY 96.50

From 52W high

−46.53%

Volume

7.98M

Market cap

CNY 228.08B

ValuationView details →

P/E (Fwd)

—

EV/EBITDA

61.2x

P/E (TTM)

247.8x

RSI (14)

26.6

MomentumView details →

1D Return

−3.97%

YTD Return

—

ValuationView details →

P/E (Fwd)

—

P/E (TTM)

247.8x

EV/EBITDA

61.2x

EV/Sales

25.6x

P/S (TTM)

25.8x

P/B (TTM)

11.8x

ProfitabilityView details →

Gross Margin

30.99%

Net Margin

14.12%

EBITDA Margin

41.85%

ROE (TTM)

6.36%

ROA (TTM)

4.22%

Asset Turnover

0.30x

GrowthView details →

Revenue YoY

—

EPS YoY

—

FCF YoY

—

Revenue CAGR 3Y

+58.67%

EPS CAGR 3Y

+335.89%

EBITDA YoY

—

MomentumView details →

1D Return

−3.97%

YTD Return

—

1Y Return

—

RSI (14)

26.6

vs 50D SMA

−28.73%

vs 200D SMA

—

Capital & dividendView details →

Debt/Equity

0.25x

Current Ratio

2.49x

Quick Ratio

2.07x

Div Yield

—

Div Rate

—

Div Growth 1Y

—

EarningsView details →

EPS (Actual)

—

EPS Surprise

—

Beats (12Q)

—

Next Q EPS Est

—

Avg Surprise (4Q)

—

Rev Surprise

—

Financials snapshotView financials →

Revenue (TTM)

—

Net Income (TTM)

—

Op. CF (TTM)

—

Latest newsMore news →

Shenghe Jingwei announced that its 2.5D silicon-bridge technology for packages up to six times reticle size had completed a stage of validation and was ready for customer product introduction validation.3d ago

Shenghe Jingwei officially unveiled its self-developed SmartPoser®-BD high-performance computing packaging technology platform based on silicon-bridge interconnect technology.3d ago

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Latest newsMore news →

Shenghe Jingwei announced that its 2.5D silicon-bridge technology for packages up to six times reticle size had completed a stage of validation and was ready for customer product introduction validation.3d ago Shenghe Jingwei officially unveiled its self-developed SmartPoser®-BD high-performance computing packaging technology platform based on silicon-bridge interconnect technology.3d ago SJ Semiconductor's R&D building was completed and opened in Jiangyin High-tech Zone on September 9.36d ago