Amkor Technology, Inc.
- Open
- 81.89
- Day high
- 83.47
- Day low
- 79.88
- Prev close
- 86.23
- Volume
- 497K
- Mkt cap
- $21.4B
- P/E (TTM)
- 49.0
- EPS (TTM)
- $1.67
- P/B
- 4.7
- P/S
- 3.0
- Yield
- 0.39%
- Per share
- $0.33
- ▼Insiders net selling -$8.6M over the last 3 months (0 open-market buys, 11 sales)
- 🏛Institutions accumulating (13F)
Amkor Technology, Inc. (AMKR) is a Technology company listed on NASDAQ. The stock is up 301% over the past year. Over the trailing 3 months, insiders filed 0 open-market buys and 11 sales (SEC Form 4). Drillr has 1 published research article covering AMKR.
Amkor Technology, Inc. (AMKR) financials & analyst ratings
Fundamentals (TTM)
Analyst consensus · 4 analysts
Source: exchange market data + company filings. Figures are trailing-twelve-month or as most recently reported. For informational purposes only — not investment advice.
AMKR earnings date, history & EPS estimates
| Report date | EPS est | EPS actual | Surprise | Revenue | Rev. surprise |
|---|---|---|---|---|---|
| Apr 27, 2026 | $0.23 | $0.33 | +43.5% | $1.7B | +3.3% |
| May 1, 2023 | $0.17 | $0.18 | +5.9% | $1.5B | +1.4% |
| Feb 13, 2023 | $0.70 | $0.67 | -4.3% | $1.9B | +3.0% |
| Oct 31, 2022 | $0.93 | $1.24 | +33.3% | $2.1B | +7.9% |
| May 2, 2022 | $0.57 | $0.69 | +21.1% | $1.6B | +2.6% |
| Feb 14, 2022 | $0.69 | $0.89 | +29.0% | $1.7B | +4.0% |
| Feb 8, 2021 | $0.37 | $0.52 | +40.5% | $1.4B | +5.5% |
| Jul 27, 2020 | $0.03 | $0.23 | +766.6% | $1.2B | +475.0% |
| Apr 27, 2020 | $0.16 | $0.26 | +62.5% | $1.2B | +62.5% |
| Feb 10, 2020 | $0.23 | $0.41 | +78.3% | $1.2B | +23.9% |
| May 2, 2019 | $-0.15 | $-0.04 | +73.3% | $895M | -37.5% |
| Feb 11, 2019 | $0.08 | $0.12 | +50.0% | $1.1B | +50.0% |
AMKR insider trading activity (SEC Form 4)
| Date | Insider | Type | Shares | Price |
|---|---|---|---|---|
| Jun 25, 2026 | ALEXANDER DOUGLAS Adirector | Grant | 8 | — |
| Jun 25, 2026 | KIM SUSAN Ydirector, 10 percent owner, other: Member of 10% owner group (5) | Grant | 3 | — |
| Jun 25, 2026 | CHURCHILL WINSTON Jdirector | Grant | 3 | — |
| Jun 25, 2026 | ALEXANDER DOUGLAS Adirector | Grant | 9 | — |
| Jun 25, 2026 | ALEXANDER DOUGLAS Adirector | Grant | 3 | — |
| Jun 25, 2026 | Liao Daniel JLdirector | Grant | 9 | — |
| Jun 25, 2026 | Carolin Roger Anthonydirector | Grant | 3 | — |
| Jun 25, 2026 | Rutten Guillaume Marie Jeandirector | Grant | 3 | — |
| Jun 25, 2026 | Morse Robert Randolphdirector | Grant | 8 | — |
| Jun 25, 2026 | Tily Gil C.director | Grant | 3 | — |
| Jun 25, 2026 | ALEXANDER DOUGLAS Adirector | Grant | 8 | — |
| Jun 25, 2026 | Morse Robert Randolphdirector | Grant | 3 | — |
| Jun 25, 2026 | McCourt MaryFrancesdirector | Grant | 8 | — |
| Jun 25, 2026 | Carolin Roger Anthonydirector | Grant | 8 | — |
| Jun 25, 2026 | Carolin Roger Anthonydirector | Grant | 9 | — |
Source: AMKR SEC Form 4 filings, latest Jun 25, 2026. For informational purposes only — not investment advice.
See the full AMKR insider & 13F page →Amkor Technology, Inc. company profile
Overview
Amkor Technology, Inc. (NASDAQ:AMKR) is a leading provider of outsourced semiconductor assembly and test services founded in 1968 and headquartered in Tempe, Arizona. The company went public in 1998 and has grown to become one of the world's largest outsourced semiconductor assembly and test services (OSAT) providers. Amkor serves as a critical link in the global semiconductor supply chain, providing specialized packaging and testing services that transform raw semiconductor wafers into finished integrated circuits ready for use in electronic devices. With manufacturing facilities across Asia, Europe, and plans for expansion in the United States, Amkor has established itself as a key partner to major semiconductor companies, fabless chip designers, and original equipment manufacturers worldwide.
Business
Amkor operates in the semiconductor assembly and test services industry, commonly known as OSAT (Outsourced Semiconductor Assembly and Test). The company provides critical back-end services in semiconductor manufacturing, taking silicon wafers that have been fabricated with integrated circuits and transforming them into finished, packaged chips ready for use in electronic devices. The semiconductor manufacturing process consists of two main phases: front-end (wafer fabrication) and back-end (assembly and test). While front-end involves creating the actual circuits on silicon wafers, back-end involves cutting the wafers into individual chips, packaging them for protection and electrical connection, and testing them for functionality. This is where Amkor specializes. Amkor's core services include semiconductor packaging, which involves encasing individual chips in protective housings that provide electrical connections to circuit boards, and test services, which verify that packaged semiconductors function correctly before shipment. The company offers various packaging technologies ranging from traditional lead frame packages to advanced solutions like flip-chip ball grid arrays, system-in-package modules, and cutting-edge 2.5D packaging for high-performance computing applications. The company's revenue is distributed across four main market segments: Communications (approximately 44% of revenue), serving smartphone and telecommunications equipment manufacturers; Automotive and Industrial (approximately 20%), providing chips for vehicles and industrial equipment; Consumer (approximately 20%), serving wearables, IoT devices, and consumer electronics; and Computing (approximately 16%), focusing on data center, networking, and PC applications. Advanced packaging technologies, which command higher margins and serve growth markets like AI and high-performance computing, represent approximately 76% of total revenue.
Revenue model
Amkor generates revenue primarily through contract manufacturing services, charging customers fees for packaging and testing their semiconductor chips. The company operates on a fee-for-service model where customers provide silicon wafers, and Amkor performs the assembly and test processes, returning finished packaged semiconductors. Revenue is typically recognized when services are completed and products are shipped. The company's customers include integrated device manufacturers (IDMs) like Intel and Infineon, fabless semiconductor companies that design chips but outsource manufacturing, foundries like TSMC that fabricate wafers, and original equipment manufacturers that use semiconductors in their products. Major customers include Apple (through its iOS ecosystem), various Android smartphone manufacturers, automotive suppliers, and data center companies. Amkor's margins are influenced by several key factors. Technology mix significantly impacts profitability, with advanced packaging solutions like 2.5D packaging, system-in-package (SiP), and flip-chip technologies commanding higher margins than traditional lead frame packages. Capacity utilization is crucial since the company operates capital-intensive facilities with high fixed costs. Customer concentration affects pricing power, as major customers like Apple can negotiate more favorable terms. Geographic mix influences costs, with facilities in different countries offering varying labor and operational cost structures. External factors affecting margins include commodity prices for materials like gold, copper, and specialty chemicals used in packaging, labor costs in key manufacturing regions, and equipment costs for advanced packaging machinery. Currency fluctuations impact costs and revenues across Amkor's global operations. Cyclical demand patterns in end markets, particularly smartphones and PCs, create utilization volatility that directly affects profitability. Technological transitions require significant capital investments but can provide competitive advantages and margin expansion opportunities when successfully executed.
Competitive moat
Amkor's competitive moat is moderately strong but faces ongoing challenges from technological evolution and competitive pressures. The company's primary moat stems from its scale and manufacturing expertise in advanced packaging technologies. With over 50 years of experience and significant capital investments in specialized equipment and clean room facilities, Amkor has built substantial barriers to entry for new competitors. The company's technological capabilities in advanced packaging, particularly in 2.5D packaging for AI chips, system-in-package solutions, and emerging technologies like co-packaged optics, provide competitive differentiation. These advanced technologies require significant R&D investments, specialized equipment, and manufacturing know-how that take years to develop. Amkor's partnerships with leading foundries like TSMC and key customers create switching costs and relationship advantages. However, the moat faces several challenges. The OSAT industry is highly competitive with major players like ASE Group, JCET, and Powertech Technology offering similar services. Customer concentration weakens Amkor's bargaining power, particularly with major customers like Apple who can negotiate favorable terms or potentially bring services in-house. The industry's cyclical nature and dependence on consumer electronics creates revenue volatility that limits pricing power. Technological disruption poses ongoing risks, as new packaging technologies or manufacturing approaches could obsolete existing capabilities. The shift toward more advanced packaging is both an opportunity and a threat, requiring continuous capital investment to maintain technological relevance. Geographic and geopolitical risks affect the company's Asian-heavy manufacturing footprint, though expansion into Vietnam and planned U.S. facilities provide some diversification. The moat is further challenged by capital intensity requirements that limit returns on invested capital and create pressure to maintain high utilization rates. While Amkor has established market position and technological capabilities, the competitive landscape and industry dynamics suggest a moderate moat that requires continuous investment and execution to maintain.
Risks & safety
Amkor demonstrates a solid financial position with manageable debt levels and adequate liquidity, though recent profitability has been modest. • Liquidity and Solvency: Strong cash position of $1.06 billion and current ratio of 2.06x provide substantial liquidity buffer. Debt-to-equity ratio of 0.31x indicates conservative leverage. Free cash flow turned negative in Q1 2025 at -$56 million due to high capital expenditures, but full-year 2024 generated $345 million in free cash flow. • Valuation Metrics: Current P/E ratio of 53x appears elevated due to low Q1 earnings, but full-year 2024 P/E of 18x is more reasonable. EV/EBITDA of 6.0x suggests moderate valuation. Price-to-book ratio of 1.07x indicates trading near book value. • Operational Considerations: High capital expenditure requirements ($850 million planned for 2025) create cash flow pressures. Revenue cyclicality in key end markets (smartphones, PCs) creates earnings volatility. Customer concentration risk, particularly with Apple ecosystem, affects revenue stability.
Recent development
Over the past few years, Amkor has executed a strategic transformation focused on advanced packaging technologies and geographic diversification. The company has significantly expanded its capabilities in 2.5D packaging for AI and high-performance computing applications, with 2.5D revenue expected to quadruple compared to 2023 levels. This positions Amkor to capitalize on the artificial intelligence boom and growing demand for advanced semiconductors in data centers. Geographic expansion has been a key strategic priority, with the company qualifying a new manufacturing facility in Vietnam and securing $407 million in CHIPS Act funding for a planned advanced packaging facility in Arizona. The U.S. facility represents a significant strategic shift, allowing Amkor to serve customers requiring domestic semiconductor assembly capabilities and reducing geopolitical risks associated with its historically Asia-focused operations. Technology partnerships have deepened, particularly with TSMC through expanded collaboration agreements and with key customers in the automotive sector like Infineon. The company has also been developing next-generation technologies including organic interposer technology for mass production launch in early 2025 and co-packaged optics solutions for high-speed data applications. Market diversification efforts have focused on reducing dependence on traditional consumer electronics by expanding in automotive, industrial, and computing segments. The automotive and industrial segment has grown to represent approximately 20% of revenue, while computing has reached record levels driven by AI and data center demand. Advanced packaging now represents 76% of total revenue, up from lower levels in previous years, reflecting the successful transition toward higher-value services.
AMKR company profile · for informational purposes only — not investment advice.
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